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#443906
Tue 28 Nov 2017 05:32:PM
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Joined: Feb 2001
Posts: 381,903
Launch Director
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OP
Launch Director
Joined: Feb 2001
Posts: 381,903 |
Scientists have invented a new approach to testing the multilayered, three-dimensional computer chips that now appear in some of the latest consumer devices. The novel method may be the answer the semiconductor industry needs to quickly assess the reliability of this relatively new chip construction model. Source: Microwave-based test method can help keep 3-D chip designers' eyes open
David Cottle
UBB Owner & Administrator
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