Intel’s EMIB was the foundation of the Kaby Lake-G partnership with AMD. Intel’s Foveros stacked-die technology produced the upcoming Lakefield chip. Now Intel is combining EMIB and Foveros into what it’s calling “co-EMIB,” alongside a more advanced ODI interface. 

Both technologies will “improve product-level performance, power and area while enabling a complete rethinking of system architecture,” Intel said in a blog post. Both represent advances in how the chips are packaged and connected, rather than changes in the underlying silicon or the overall microarchitecture.

To read this article in full, please click here

Source: Intel takes the chiplet concept to the next level with co-EMIB, ODI connections