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#496875
Thu 04 Apr 2019 09:48:AM
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Joined: Feb 2001
Posts: 381,904
Launch Director
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OP
Launch Director
Joined: Feb 2001
Posts: 381,904 |
Abstract: The objective of this task is to evaluate thermal cycle behavior of advanced 2.5/3D electronics — commercial-off the-shelf (COTS) —packages of different configurations assembled onto printed circuit boards (PCBs). Three key approaches were considered for evaluation. The first approach focused on the through-mold via (TMV™) technology at assembly level. The second approach focused on evaluation of 2.5D (also known as, System in Package (SiP)) in fine pitch ball grid array (FPGA). The third app... Source: 2.5/3D Daisy Chain Reliability Evaluation
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